BQ25071-Q1 Datasheet, PDF (3/22 Pages) Texas Instruments – Automotive Qualified

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5 Device Comparison Table
PART NUMBER
bq25071QWDQCRQ1
bq25071QWDQCTQ1
V_BAT(OVCH)
3.7 V
3.7 V
V_BAT(FLOAT)
3.5 V
3.5 V
6 Pin Configuration and Functions
DQC Package
10-Pin WSON
Top View
IN ₁
ISET 2
GND 3
LDO 4
TS 5
10 _OUT
9 GND
8 CHG
7 EN
6 BAT
bq25071-Q1
SLUSCD6 – APRIL 2016
V_(OVP)
10.5 V
10.5 V
V_(LDO)
4.9 V
4.9 V
PIN
NAME
NO.
IN
1
ISET
2
GND
3, 9
LDO
4
TS
5
BAT
6
EN
7
CHG
8
OUT
10
Thermal
Pad
Pad
Pin Functions
I/O
DESCRIPTION
I
Input power supply. IN is connected to the external DC supply (AC adapter or USB port). Bypass IN to GND
with at least a 0.1 μF ceramic capacitor.
Input current programming bias pin. Connect a resistor from ISET to GND to program the input current limit
O when the user programmable mode is selected by grounding the EN pin. The resistor range is between 1 kΩ
and 10 kΩ to set the current between 100 mA and 1 A.
– Ground pin. Connect to the thermal pad and the ground plane of the circuit.
O
LDO output. LDO is regulated to 4.9V and drives up to 50 mA. Bypass LDO to GND with a 0.1 μF ceramic
capacitor. LDO is enabled when V_(UVLO) < V_IN < V_(OVP).
Battery pack NTC monitoring input. Connect a resistor divider from LDO to GND with TS connected to the
I
center tap to set the charge temperature window. The battery pack NTC is connected in parallel with the
bottom resistor of the divider. See the Detailed Design Procedure section for details on the selecting the
proper component values.
I BAT is the sense input for the battery voltage. Connect BAT and OUT to the battery.
Enable input. Drive EN high to disable the IC. Connect EN to GND to place the bq25071-Q1Q in the user
I
programmable mode using the ISET input where the input current is programmed. Leave EN floating to place
the bq25071-Q1Q in USB500 mode. See the Input Current Limit Control (EN) section for details on using the
EN interface.
O
Charge status indicator open-drain output. CHG is pulled low while the device is charging the battery. CHG
goes high impedance when the battery is fully charged.
O
System output connection. Bypass the OUT to GND with a 1 μF ceramic capacitor. Connect OUT and BAT
together.
There is an internal electrical connection between the exposed thermal pad and the GND pin of the device.
–
The thermal pad must be connected to the same potential as the GND pin on the printed circuit board. Do not
use the thermal pad as the primary ground input for the device. GND pin must be connected to ground at all
times.
Copyright © 2016, Texas Instruments Incorporated
Product Folder Links: bq25071-Q1
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