AMC1305L25 Datasheet, PDF (4/39 Pages) Texas Instruments – AMC1305x High-Precision, Reinforced Isolated Delta-Sigma Modulators

AMC1305L25, AMC1305M05, AMC1305M25
SBAS654C – JUNE 2014 – REVISED DECEMBER 2014
www.ti.com
8 Specifications
8.1 Absolute Maximum Ratings
over the operating ambient temperature range (unless otherwise noted)⁽¹⁾
MIN
Supply voltage, AVDD to AGND or DVDD to DGND
–0.3
Analog input voltage at AINP, AINN
AGND – 6
Digital input voltage at CLKIN, CLKIN_N
DGND – 0.3
Input current to any pin except supply pins
–10
Maximum virtual junction temperature, T_J
Storage temperature, T_stg
–65
MAX
6.5
AVDD + 0.5
DVDD + 0.3
10
150
150
UNIT
V
V
V
mA
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and do not imply functional operation of the device at these or any other conditions beyond those indicated. Exposure to absolute-
maximum-rated conditions for extended periods may affect device reliability.
8.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged device model (CDM), per JEDEC specification JESD22-
C101 ⁽²⁾
VALUE
±1000
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
8.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
T_A
Operating ambient temperature range
–40
AVDD
High-side (analog) supply voltage
4.5
DVDD
Controller-side (digital) supply voltage
3.0
NOM
5.0
3.3
MAX
125
5.5
5.5
UNIT
°C
V
V
8.4 Thermal Information
THERMAL METRIC⁽¹⁾
AMC1305x
DW (SOIC)
UNIT
16 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
80.2
40.5
45.1
°C/W
11.9
44.5
n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
8.5 Regulatory Information
VDE
Certified according to DIN V VDE V 0884-10
File number: 40040142
UL, cUL
Recognized under UL1577 component recognition and CSA
component acceptance NO 5 programs
File number: E181974
4
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