AMC1305L25-Q1 Datasheet, PDF (4/38 Pages) Texas Instruments – High-Precision, Reinforced Isolated Delta-Sigma Modulators

AMC1305L25-Q1, AMC1305M05-Q1, AMC1305M25-Q1
SBAS797 – FEBRUARY 2017
7 Specifications
www.ti.com
7.1 Absolute Maximum Ratings
over the operating ambient temperature range (unless otherwise noted)⁽¹⁾
MIN
Supply voltage, AVDD to AGND or DVDD to DGND
–0.3
Analog input voltage at AINP, AINN
AGND – 6
Digital input voltage at CLKIN, CLKIN_N
DGND – 0.3
Input current to any pin except supply pins
–10
Maximum virtual junction temperature, T_J
Storage temperature, T_stg
–65
MAX
6.5
AVDD + 0.5
DVDD + 0.3
10
150
150
UNIT
V
V
V
mA
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and do not imply functional operation of the device at these or any other conditions beyond those indicated. Exposure to absolute-
maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human body model (HBM), per AEC Q100-002⁽¹⁾
Charged device model (CDM), per AEC Q100-011
VALUE
±2500
±1000
(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
UNIT
V
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
AVDD
High-side (analog) supply voltage
4.5
DVDD
Controller-side (digital) supply voltage
3.0
T_A
Operating ambient temperature range
–40
NOM
5.0
3.3
MAX
5.5
5.5
125
UNIT
V
V
°C
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
AMC1305x-Q1
DW (SOIC)
UNIT
16 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
80.2
°C/W
40.5
°C/W
45.1
°C/W
11.9
°C/W
44.5
°C/W
n/a
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.5 Power Ratings
PARAMETER
P_D
Maximum power dissipation
(both sides)
P_D1
Maximum power dissipation
(high-side supply)
P_D2
Maximum power dissipation
(low-side supply)
TEST CONDITIONS
AVDD = 5.5 V, DVDD = 5.5 V, LVDS, R_LOAD = 100 Ω
AVDD = 5.5 V
DVDD = 5.5 V, LVDS, R_LOAD = 100 Ω
VALUE
89.1
45.1
44
UNIT
mW
mW
mW
4
Submit Documentation Feedback
Copyright © 2017, Texas Instruments Incorporated
Product Folder Links: AMC1305L25-Q1 AMC1305M05-Q1 AMC1305M25-Q1