ADS7041 Datasheet, PDF (4/37 Pages) Texas Instruments – Ultra-Low Power, Ultra-Small Size, 10-Bit, 1-MSPS, SAR ADC

ADS7041
SBAS675A – NOVEMBER 2014 – REVISED NOVEMBER 2014
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings⁽¹⁾
AVDD to GND
DVDD to GND
AINP to GND
AINM to GND
Digital input voltage to GND
MIN
MAX
UNIT
–0.3
3.9
V
–0.3
3.9
V
–0.3
AVDD + 0.3
V
–0.3
0.3
V
–0.3
DVDD + 0.3
V
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 Handling Ratings
T_stg
V_(ESD)
Storage temperature range
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
pins ⁽¹⁾
Charged device model (CDM), per JEDEC specification
JESD22-C101, all pins⁽²⁾
MIN
–60
–2000
–1000
MAX
150
2000
1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
°C
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
AVDD
DVDD
T_A
Analog supply voltage range
Digital supply voltage range
Operating free-air temperature
MIN
MAX
UNIT
1.8
3.6
V
1.65
3.6
V
–40
125
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
ADS7041
RUG (X2QFN) DCU (VSSOP)
UNIT
8 PINS
8 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
177.5
51.5
76.7
1.0
76.7
N/A
235.8
79.8
117.6
8.9
116.5
N/A
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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