5962R9951705VXA Datasheet, PDF (4/36 Pages) Texas Instruments – LM117QML 3-Terminal Adjustable Regulator

LM117QML, LM117QML-SP
SNVS356D – MARCH 2006 – REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings⁽¹⁾
Power Dissipation⁽²⁾
Input-Output Voltage Differential
Storage Temperature
Maximum Junction Temperature (T_Jmax
Lead Temperature Metal Package
Thermal Resistance
θ_JA
θ_JC
Package Weight
ESD Tolerance ⁽⁴⁾
T0 Still Air
T0 500LF/Min Air flow
PFM Still Air
PFM 500LF/Min Air flow
CFP "WG" (device 03, 05) Still Air
CFP "WG" (device 03, 05) 500LF/Min Air flow
CFP "GW" (device 06, 07) Still Air
CFP "GW" (device 06, 07) 500LF/Min Air flow
LCCC Still Air
LCCC 500LF/Min Air flow
T0
PFM Metal Can
CFP "WG" (device 03, 05)⁽³⁾
CFP "GW" (device 06, 07)
LCCC
PFM Metal Can
CFP "WG" (device 03, 05)
CFP "GW" (device 06, 07)
Internally Limited
+40V, −0.3V
−65°C ≤ T_A ≤ +150°C
+150°C
300°C
39°C/W
14°C/W
186°C/W
64°C/W
115°C/W
66°C/W
130°C/W
80°C/W
88°C/W
62°C/W
1.9°C/W
21°C/W
3.4°C/W
7°C/W
12°C/W
960mg
365mg
410mg
3KV
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2) The maximum power dissipation must be derated at elevated temperatures and is dictated by T_Jmax (maximum junction temperature),
θ_JA (package junction to ambient thermal resistance), and T_A (ambient temperature). The maximum allowable power dissipation at any
temperature is P_Dmax = (T_Jmax - T_A)/θ_JA or the number given in the Absolute Maximum Ratings, whichever is lower. "Although power
dissipation is internally limited, these specifications are applicable for power dissipations of 2W for the PFM, LCCC, and CFP packages,
and 20W for the TO package."
(3) The package material for these devices allows much improved heat transfer over our standard ceramic packages. In order to take full
advantage of this improved heat transfer, heat sinking must be provided between the package base (directly beneath the die), and either
metal traces on, or thermal vias through, the printed circuit board. Without this additional heat sinking, device power dissipation must be
calculated using θ_JA, rather than θ_JC, thermal resistance. It must not be assumed that the device leads will provide substantial heat
transfer out the package, since the thermal resistance of the leadframe material is very poor, relative to the material of the package
base. The stated θ_JC thermal resistance is for the package material only, and does not account for the additional thermal resistance
between the package base and the printed circuit board. The user must determine the value of the additional thermal resistance and
must combine this with the stated value for the package, to calculate the total allowed power dissipation for the device.
(4) Human body model, 100 pF discharged through a 1.5 kΩ resistor.
Recommended Operating Conditions
Operating Temperature Range
Input Voltage Range
−55°C ≤ T_A ≤ +125°C
4.25V to 41.25V
4
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