THS4500IDR Datasheet, PDF (37/48 Pages) Texas Instruments – WIDEBAND, LOW-DISTORTION, FULLY DIFFERENTIAL AMPLIFIERS

PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Orderable Device
THS4501CDG4
THS4501CDGN
THS4501CDGNG4
THS4501ID
THS4501IDG4
THS4501IDGK
THS4501IDGKG4
THS4501IDGN
THS4501IDGNG4
THS4501IDR
THS4501IDRG4
Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C)
(1)
Drawing
Qty
(2)
(3)
ACTIVE
SOIC
D
8
75 Green (RoHS CU NIPDAU Level-1-260C-UNLIM
0 to 70
& no Sb/Br)
ACTIVE MSOP-
DGN 8
PowerPAD
80 Green (RoHS CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
0 to 70
ACTIVE MSOP-
DGN 8
PowerPAD
80 Green (RoHS CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
0 to 70
ACTIVE
SOIC
D
8
75 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85
& no Sb/Br)
ACTIVE
SOIC
D
8
75 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85
& no Sb/Br)
ACTIVE VSSOP
DGK 8
80 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85
& no Sb/Br)
ACTIVE VSSOP
DGK 8
80 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85
& no Sb/Br)
ACTIVE MSOP-
DGN 8
PowerPAD
80 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85
& no Sb/Br)
ACTIVE MSOP-
DGN 8
PowerPAD
80 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85
& no Sb/Br)
ACTIVE
SOIC
D
8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85
& no Sb/Br)
ACTIVE
SOIC
D
8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85
& no Sb/Br)
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Top-Side Markings
(4)
4501C
BFD
BFD
4501I
4501I
ASW
ASW
BFE
BFE
4501I
4501I
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Samples
Addendum-Page 2