THS4281 Datasheet, PDF (31/43 Pages) Texas Instruments – VERY LOW-POWER, HIGH-SPEED, RAIL-TO-RAIL INPUT AND OUTPUT VOLTAGE-FEEDBACK OPERATIONAL AMPLIFIER

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Layout Examples (continued)
THS4281
SLOS432B – APRIL 2004 – REVISED OCTOBER 2015
Layer 3 − GND
Figure 78. THS4281EVM Board Layout
BOTTOM
Figure 79. THS4281EVM Board Layout
10.3 Thermal Considerations
The THS4281 does not incorporate automatic thermal shutoff protection, so the designer must take care to
ensure that the design does not violate the absolute maximum junction temperature of the device. Failure may
result if the absolute maximum junction temperature of +150°C is exceeded. For long-term dependability, the
junction temperature should not exceed +125°C.
The thermal characteristics of the device are dictated by the package and the PCB. Maximum power dissipation
for a given package can be calculated using the following formula.
P_Dmax = (T_max - T_A) / θ_JA
where
• P_Dmax is the maximum power dissipation in the amplifier (W).
• T_max is the absolute maximum junciton temperature (ºC).
• T_A is the ambient temperature (ºC).
• θ_JA = θ_JC + θ_CA
• θ^JC is the thermal coefficient from the silicon junctions to the case (ºC/W).
• θ^JA is the thermal coefficient from the case to ambient air (ºC/W).
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