THS4281 Datasheet, PDF (2/43 Pages) Texas Instruments – VERY LOW-POWER, HIGH-SPEED, RAIL-TO-RAIL INPUT AND OUTPUT VOLTAGE-FEEDBACK OPERATIONAL AMPLIFIER

THS4281
SLOS432B – APRIL 2004 – REVISED OCTOBER 2015
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Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ..................................... 4
6.2 ESD Ratings ............................................................ 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information .................................................. 4
6.5 Electrical Characteristics, V_S = 3 V (V_S+ = 3 V, V_S– =
GND) .......................................................................... 5
6.6 Electrical Characteristics, V_S = 5 V (V_S+ = 5 V, V_S– =
GND) .......................................................................... 7
6.7 Electrical Characteristics, V_S = ±5 V......................... 9
6.8 Dissipation Ratings ................................................. 11
6.9 Typical Characteristics ............................................ 12
7 Detailed Description ............................................ 24
7.1 Overview ................................................................. 24
7.2 Feature Description................................................. 24
7.3 Device Functional Modes........................................ 25
8 Application and Implementation ........................ 26
8.1 Application Information............................................ 26
8.2 Typical Application ................................................. 27
9 Power Supply Recommendations...................... 29
9.1 Power-Supply Decoupling Techniques and
Recommendations ................................................... 29
10 Layout................................................................... 29
10.1 Layout Guidelines ................................................. 29
10.2 Layout Examples................................................... 30
10.3 Thermal Considerations ........................................ 31
11 Device and Documentation Support ................. 33
11.1 Documentation Support ........................................ 33
11.2 Community Resources.......................................... 33
11.3 Trademarks ........................................................... 33
11.4 Electrostatic Discharge Caution ............................ 33
11.5 Glossary ................................................................ 33
12 Mechanical, Packaging, and Orderable
Information ........................................................... 33
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (November 2009) to Revision B
Page
• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
• Removed the Packaging/Ordering Information table ............................................................................................................ 1
• Removed Design Tools section ............................................................................................................................................. 1
• Updated Thermal Values ....................................................................................................................................................... 1
• Removed the Applications Section Contents section .......................................................................................................... 24
• Removed the Bill of Materials section ................................................................................................................................. 24
Changes from Original (April 2004) to Revision A
Page
• Updated document format to current standards..................................................................................................................... 1
• Deleted Lead temperature specification from Absolute Maximum Ratings table................................................................... 4
• Revised Driving Capacitive Loads section ........................................................................................................................... 26
• Changed Board Layout section; revised statements in fourth recommendation about how to make connections to
other wideband devices on the board .................................................................................................................................. 29
2
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