THS6022_16 Datasheet, PDF (30/44 Pages) Texas Instruments – 250-mA DUAL DIFFERENTIAL LINE DRIVER

THS6022
SLOS225D – SEPTEMBER 1998 – REVISED JULY 2007
www.ti.com
More-complete details of the thermal pad installation process and thermal management techniques can be found
in the PowerPAD Thermally Enhanced Package application report (SLMA002).
MAXIMUM POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
6
T_J = 150°C
PCB Size = 3” x 3”
5
No Air Flow
4
θ_JA = 37.5°C/W
2 oz Trace and
Copper Pad
3
with Solder
2
1 θ_JA = 97.7°C/W
2 oz Trace and Copper Pad
without Solder
0
−40 −20 0
20 40 60 80
T_A − Free-Air Temperature − °C
Figure 59.
100
G052
30
Submit Documentation Feedback