THS6022_16 Datasheet, PDF (3/44 Pages) Texas Instruments – 250-mA DUAL DIFFERENTIAL LINE DRIVER

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THS6022
SLOS225D – SEPTEMBER 1998 – REVISED JULY 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
DESCRIPTION (CONTINUED)
The THS6022 is packaged in the patented PowerPAD™ package. This package provides outstanding thermal
characteristics in a small-footprint package that is fully compatible with automated surface-mount assembly
procedures. The exposed thermal pad on the underside of the package is in direct contact with the die. By
simply soldering the pad to the PWB copper and using other thermal outlets, the heat is conducted away from
the junction.
T_A
0°C to 70°C
–40°C to 85°C
AVAILABLE OPTIONS
PACKAGED DEVICE
PowerPAD™ PLASTIC
SMALL OUTLINE⁽¹⁾ (PWP)
MicroStar Junior™
(GQE)
THS6022CPWP
THS6022CGQE
THS6022IPWP
THS6022IGQE
EVALUATION MODULE
THS6022EVM
–
(1) The PWP packages are available taped and reeled. Add an R suffix to the device type (e.g.,
THS6022CPWPR)
NAME
1OUT
1IN–
1IN+
2OUT
2IN–
2IN+
V_CC+
V_CC–
NC
TERMINAL FUNCTIONS
TERMINAL
PWP PACKAGE
TERMINAL NO.
2
5
4
13
10
11
3, 12
1, 14
6, 7, 8, 9
GQE PACKAGE
TERMINAL NO.
A3
F1
D1
A7
F9
D9
B1, B9
A4, A6
NA
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