BQ50002 Datasheet, PDF (30/35 Pages) Texas Instruments – Low-Cost 5-V Wireless Power Transmitter Analog Front

RHB0032N
A
SCALE 3.000
5.1
4.9
PACKAGE OUTLINE
VQFN - 0.9 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
B
PIN 1 INDEX AREA
0.9 MAX
0.05
0.00
9
28X 0.5
8
2X 3.5
3.45 0.1
5.1
4.9
0.08
0.05
SECTION A-A ^A-A30.000
TYPICAL
C
SEATING PLANE
0.08 C
16
EXPOSED
THERMAL PAD
17
(0.2) TYP
2X
3.5
33
A
A _SYMM
32X
0.3
0.2
1
24
0.1 C A B
0.05 C
32
PIN 1 ID
(OPTIONAL)
NOTES:
SYMM
25
32X
0.5
0.3
4222893/A 04/2016
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
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