TLE2426IDRG4 Datasheet, PDF (3/30 Pages) Texas Instruments – THE RAIL SPLITTER PRECISION VIRTUAL GROUND

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TLE2426, TLE2426Y
THE RAIL SPLITTER"
PRECISION VIRTUAL GROUND
SLOS098D − AUGUST 1991 − REVISED MAY 1998
description (continued)
The C-suffix devices are characterized for operation from 0°C to 70°C. The I suffix devices are characterized
for operation from −40°C to 85°C. The M suffix devices are characterized over the full military temperature range
of −55°C to 125°C.
D, JG, OR P PACKAGE
(TOP VIEW)
LP PACKAGE
(TOP VIEW)
OUT 1
COMMON 2
IN 3
NC 4
8 NOISE REDUCTION
7 NC
6 NC
5 NC
IN
COMMON
OUT
NC − No internal connection
TLE2426Y chip information
This chip, properly assembled, displays characteristics similar to the TLE2426C. Thermal compression or
ultrasonic bonding may be used on the doped aluminum bonding pads. The chips may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(3) ⁽³⁾
(2) (2)
(1) ₍₁₎
IN
(3)
NOISE ⁽⁸⁾
REDUCTION
+1
60
(2)
COMMON
CHIP THICKNESS:
15 MILS TYPICAL
(1) _OUT
BONDING PADS:
4 × 4 MILS MINIMUM
TJmax = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN
MILS.
(8)
NOTE A: Both bonding pads numbered 1, both numbered 2,
88
and both numbered 3, must be bonded out to the
corresponding functions pin.
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