TLE2426IDRG4 Datasheet, PDF (20/30 Pages) Texas Instruments – THE RAIL SPLITTER PRECISION VIRTUAL GROUND

PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Orderable Device
TLE2426ILPR
TLE2426ILPRE3
TLE2426IP
TLE2426IPE4
TLE2426MD
TLE2426MDG4
TLE2426MFKB
TLE2426MJGB
TLE2426MLP
TLE2426MP
Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C)
(1)
Drawing
Qty
(2)
(3)
ACTIVE
TO-92
LP
3 2000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
ACTIVE
TO-92
LP
3 2000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
ACTIVE
SOIC
D
8
75 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125
& no Sb/Br)
ACTIVE
SOIC
D
8
75 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125
& no Sb/Br)
OBSOLETE LCCC
FK
20
TBD
Call TI
Call TI
-55 to 125
OBSOLETE CDIP
JG
8
TBD
Call TI
Call TI
-55 to 125
OBSOLETE TO-92
LP
3
TBD
Call TI
Call TI
-55 to 125
OBSOLETE PDIP
P
8
TBD
Call TI
Call TI
-55 to 125
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Top-Side Markings
(4)
2426I
2426I
TLE2426IP
TLE2426IP
2426M
2426M
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
Samples
Addendum-Page 2