TLE2426IDRG4 Datasheet, PDF (23/30 Pages) Texas Instruments – THE RAIL SPLITTER PRECISION VIRTUAL GROUND

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PACKAGE MATERIALS INFORMATION
26-Jan-2013
*All dimensions are nominal
Device
TLE2426CDR
TLE2426IDR
Package Type
SOIC
SOIC
Package Drawing Pins
D
8
D
8
SPQ
2500
2500
Length (mm)
367.0
367.0
Width (mm)
367.0
367.0
Height (mm)
35.0
35.0
Pack Materials-Page 2