TLE2027IDRG4 Datasheet, PDF (3/46 Pages) Texas Instruments – EXCALIBUR LOW-NOISE HIGH-SPEED PRECISION OPERATIONAL AMPLIFIERS

TLE2027, TLE2037, TLE2027A, TLE2037A, TLE2027Y, TLE2037Y
EXCALIBUR LOW-NOISE HIGH-SPEED
PRECISION OPERATIONAL AMPLIFIERS
SLOS192C − FEBRUARY 1997 − REVISED APRIL 2010
TLE202xY chip information
This chip, when properly assembled, displays characteristics similar to the TLE202xC. Thermal compression
or ultrasonic bonding may be used on the doped-aluminum bonding pads. The chip may be mounted with
conductive epoxy or a gold-silicon preform.
(6)
(8)
BONDING PAD ASSIGNMENTS
(7)
(4)
(6)
OFFSET N1
IN +
IN −
OFFSET N2
(1) V_CC+
(3)
+
(7)
(2)
− ₍₄₎
(8)
V_{CC −}
(6)
OUT
90
(7)
(1)
(2)
(8)
73
(5)
(3)
(4)
(2)
(3)
(1)
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
T_Jmax = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
3