English
Language : 

TLE2027IDRG4 Datasheet, PDF (1/46 Pages) Texas Instruments – EXCALIBUR LOW-NOISE HIGH-SPEED PRECISION OPERATIONAL AMPLIFIERS
TLE2027, TLE2037, TLE2027A, TLE2037A, TLE2027Y, TLE2037Y
EXCALIBUR LOW-NOISE HIGH-SPEED
PRECISION OPERATIONAL AMPLIFIERS
SLOS192C − FEBRUARY 1997 − REVISED APRIL 2010
D Outstanding Combination of dc Precision
and AC Performance:
Unity-Gain Bandwidth . . . 15 MHz Typ
Vn . . . . . 3.3 nV/√Hz at f = 10 Hz Typ,
2.5 nV/√Hz at f = 1 kHz Typ
VIO . . . . 25 μV Max
AVD . . . . 45 V/μV Typ With RL = 2 kΩ,
19 V/μV Typ With RL = 600 Ω
D Available in Standard-Pinout Small-Outline
Package
D Output Features Saturation Recovery
Circuitry
D Macromodels and Statistical information
D, JG, OR P PACKAGE
(TOP VIEW)
OFFSET N1 1
IN − 2
IN + 3
VCC − 4
8 OFFSET N2
7 VCC +
6 OUT
5 NC
FK PACKAGE
(TOP VIEW)
description
The TLE20x7 and TLE20x7A contain innovative
circuit design expertise and high-quality process
control techniques to produce a level of ac
performance and dc precision previously unavail-
able in single operational amplifiers. Manufac-
tured using Texas Instruments state-of-the-art
Excalibur process, these devices allow upgrades
to systems that use lower-precision devices.
NC
3 2 1 20 19
4
18
NC
IN − 5
17 VCC +
NC 6
16 NC
IN + 7
15 OUT
NC 8
14 NC
9 10 11 12 13
In the area of dc precision, the TLE20x7 and
TLE20x7A offer maximum offset voltages of
100 μV and 25 μV, respectively, common-mode
rejection ratio of 131 dB (typ), supply voltage
rejection ratio of 144 dB (typ), and dc gain of
45 V/μV (typ).
AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax AT
25°C
SMALL
OUTLINE†
CHIP
CARRIER
CERAMIC
DIP
(D)
(FK)
(JG)
25 μV
TLE2027ACD
TLE2037ACD
—
—
—
—
0°C to 70°C
100 μV
TLE2027CD
TLE2037CD
—
—
—
—
−40°C to 105°C
25 μV
TLE2027AID
TLE2037AID
—
—
—
—
100 μV
TLE2027ID
TLE2037ID
—
—
—
—
−55°C to 125°C
25 μV
100 μV
TLE2027AMD
TLE2037AMD
TLE2027MD
TLE2037MD
TLE2027AMFK
TLE2037AMFK
TLE2027MFK
TLE2037MFK
TLE2027AMJG
TLE2037AMJG
TLE2027MJG
TLE2037MJG
† The D packages are available taped and reeled. Add R suffix to device type (e.g., TLE2027ACDR).
‡ Chip forms are tested at 25°C only.
PLASTIC
DIP
(P)
TLE2027ACP
TLE2037ACP
TLE2027CP
TLE2037CP
TLE2027AIP
TLE2037AIP
TLE2027IP
TLE2037IP
TLE2027AMP
TLE2037AMP
TLE2027MP
TLE2037MP
CHIP
FORM‡
(Y)
TLE2027Y
TLE2037Y
TLE2027Y
TLE2037Y
—
—
—
—
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
www.ti.com
Copyright © 2002−2006, Texas Instruments Incorporated
1