THS6204 Datasheet, PDF (3/43 Pages) Texas Instruments – Dual-Port, Differential VDSL2 Line Driver Amplifiers

THS6204
www.ti.com ................................................................................................................................................... SBOS416C – OCTOBER 2007 – REVISED APRIL 2009
DISSIPATION RATINGS
PACKAGE
QFN-24 (RHF)
HTSSOP-24 (PWP)
θ_JC (°C/W)
1.7
0.92
θ_JA (°C/W) ^{(1) (2)}
32
31
POWER RATING⁽³⁾
(T_J = +130°C)
T_A = +25°C
T_A = +85°C
3.28W
1.4W
3.39W
1.45W
(1) This data was taken using a 4-layer, 3in × 3in (76.2mm × 76.2mm) test PCB with the PowerPAD soldered to the PCB. If the PowerPAD
is not soldered to the PCB, θ_JA increases to +74°C/W for the RHF package and +62°C/W for the PWP package.
(2) For high-power dissipation applications, soldering the PowerPAD to the PCB is required. Failure to do so may result in reduced reliability
and/or lifetime of the device. See TI technical brief SLMA002 for more information about utilizing the PowerPAD thermally enhanced
package.
(3) Power rating is determined with a junction temperature of +130°C. This is the point where distortion starts to substantially increase and
long-term reliability starts to be reduced. Thermal management of the final PCB should strive to keep the junction temperature at or
below +130°C for best performance and reliability.
RECOMMENDED OPERATING CONDITIONS
Supply voltage, V_S– to V_S+
Dual supply
Single supply
Operating free-air temperature, T_A
Operating junction temperature, continuous operating temperature, T_J, QFN package
Operating junction temperature, continuous operating temperature, T_J, TSSOP package
Normal storage temperature, T_STG
THS6204
MIN
MAX
±5
±14
10
28
–40
+85
–40
+130
–40
+140
–40
+85
UNIT
V
V
°C
°C
°C
°C
QFN-24⁽⁴⁾
RHF PACKAGE
(TOP VIEW)
PIN CONFIGURATIONS^(1)(2)(3)
HTSSOP-24⁽⁴⁾
PWP PACKAGE
(TOP VIEW)
D1 IN+ 1
D2 IN+ 2
GND 3
I_ADJ 4
NC⁽⁴⁾ 5
D3 IN+ 6
D4 IN+ 7
PowerPAD
19 D1 IN-
18 D2 IN-
17 D2 OUT
16 NC⁽⁴⁾
15 D3 OUT
14 D3 IN-
13 D4 IN-
V_S- 1
BIAS-1/D1D2 2
BIAS-2/D1D2 3
D1 IN+ 4
D2 IN+ 5
GND 6
I_ADJ 7
D3 IN+ 8
D4 IN+ 9
BIAS-2/D3D4 10
BIAS-1/D3D4 11
V_S- 12
PowerPAD
24 V_S+
23 D1 OUT
22 D1 IN-
21 D2 IN-
20 D2 OUT
19 NC⁽⁴⁾
18 NC⁽⁴⁾
17 D3 OUT
16 D3 IN-
15 D4 IN-
14 D4 OUT
13 V_S+
(1) The PowerPAD is electrically isolated from all other pins and can be connected to any potential voltage range from
V_S– to V_S+. Typically, the PowerPAD is connected to the GND plane as this plane tends to physically be the largest
and is able to dissipate the most amount of heat.
(2) The THS6204 defaults to shutdown mode if no signal is present on the bias pins.
(3) The GND pin range is from V_S– to (V_S+ – 5V).
(4) NC = no connection.
Copyright © 2007–2009, Texas Instruments Incorporated
Product Folder Link(s): THS6204
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