LM34927SD Datasheet, PDF (3/26 Pages) Texas Instruments – LM34927 Integrated Secondary Side Bias Regulator for Isolated DC-DC Converters

LM34927
www.ti.com
SNVS799F – APRIL 2012 – REVISED DECEMBER 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings⁽¹⁾⁽²⁾
V_IN, UVLO to RTN
SW to RTN
SW to RTN (100ns transient)
BST to V_CC
BST to SW
R_ON to RTN
V_CC to RTN
FB to RTN
ESD Rating, Human Body Model⁽³⁾
Lead Temperature⁽⁴⁾
Storage Temperature Range
Maximum Junction Temperature
–0.3 V to 100 V
–1.5 V to V_IN +0.3 V
–5 V to VIN +0.3 V
100 V
13 V
–0.3 V to 100 V
–0.3 V to 13 V
–0.3 V to 5 V
2 kV
200°C
–55°C to +150°C
150°C
(1) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(2) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is intended to be functional. For specifications and test conditions, see the Electrical Characteristics. The RTN
pin is the GND reference electrically connected to the substrate.
(3) The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin.
(4) For detailed information on soldering plastic SO PowerPAD package, refer to the Packaging Data Book. Max solder time not to exceed
4 seconds.
Recommended Operating Ratings⁽¹⁾
V_IN Voltage
Operating Junction Temperature
7.5 V to 100 V
−40°C to +125°C
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is intended to be functional. For specifications and test conditions, see the Electrical Characteristics. The RTN
pin is the GND reference electrically connected to the substrate.
Thermal Characteristics
θ_JA
θ_JCbot
Ψ_JB
θ_JB
θ_JCtop
Ψ_JT
Junction-to-ambient thermal resistance
Junction-to-case (bottom) thermal resistance
Junction-to-board thermal characteristic parameter
Junction-to-board thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-top thermal characteristic parameter
WSON-8
41.3
3.2
19.2
19.1
34.7
0.3
SO PowerPAD-8
41.1
2.4
24.4
30.6
37.3
6.7
UNIT
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
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