LMH6515 Datasheet, PDF (29/31 Pages) National Semiconductor (TI) – 600 MHz, Digital Controlled, Variable Gain Amplifier

RGH0016A
EXAMPLE BOARD LAYOUT
WQFN - 0.8 mm max height
WQFN
16X (0.6)
16X (0.25)
1
(0.25) TYP
4
12X (0.5)
5X ( 0.2)
VIA
( 2.6)
SYMM
16
13
SEE DETAILS
12
SYMM
(3.8)
(1)
9
5
8
(1)
(3.8)
LAND PATTERN EXAMPLE
SCALE:15X
0.07 MAX
ALL AROUND
METAL
0.07 MIN
ALL AROUND
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
SOLDER MASK
DEFINED
4214978/A 10/2013
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see QFN/SON PCB application report
in literature No. SLUA271 (www.ti.com/lit/slua271).
www.ti.com