LMH6515 Datasheet, PDF (28/31 Pages) National Semiconductor (TI) – 600 MHz, Digital Controlled, Variable Gain Amplifier

RGH0016A
B
SCALE 3.500
4.1
3.9
PACKAGE OUTLINE
WQFN - 0.8 mm max height
WQFN
A
PIN 1 INDEX AREA
0.5
0.3
4.1
3.9
0.3
0.2
DETAIL
OPTIONAL TERMINAL
TYPICAL
0.8 MAX
C
SEATING PLANE
SEE TERMINAL
DETAIL
4
4X
1.5
2.6 0.1
5
8
12X 0.5
9
(0.1)
TYP
1
PIN 1 ID
(OPTIONAL)
16
13
16X
0.5
0.3
12
16X
0.3
0.2
0.1 C A B
0.05 C
NOTES:
4214978/A 10/2013
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
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