HD3SS460 Datasheet, PDF (28/34 Pages) Texas Instruments – 4 x 6 Channels USB Type-C Alternate Mode MUX

HD3SS460
SLLSEM7B – JANUARY 2015 – REVISED JUNE 2016
RHR0028A
28X (0.6)
28X (0.25)
1
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EXAMPLE BOARD LAYOUT
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(2)
SYMM
28
25
24
24X (0.5)
SYMM
(0.66)
TYP
(5.3)
(4)
( 0.2) TYP
VIA
10
15
11
14
(0.75) TYP
(3.3)
LAND PATTERN EXAMPLE
SCALE:15X
0.07 MAX
ALL AROUND
METAL
0.07 MIN
ALL AROUND
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4219075/A 11/2014
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
28
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