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| HD3SS460 Datasheet, PDF (27/34 Pages) Texas Instruments – 4 x 6 Channels USB Type-C Alternate Mode MUX | |||
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www.ti.com
RHR0028A
A
SCALE 2.700
3.6
B
3.4
HD3SS460
SLLSEM7B â JANUARY 2015 â REVISED JUNE 2016
PACKAGE OUTLINE
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
PIN 1 INDEX AREA
0.5
5.6
0.3
5.4
0.8 MAX
0.05
0.00
24X 0.5
11
10
2±0.1
2X 1.5
0.3
0.2
DETAIL
OPTIONAL TERMINAL
TYPICAL
C
SEATING PLANE
0.08
14
EXPOSED
THERMAL PAD
15
(0.2) TYP
2X
4.5
4±0.1
SEE TERMINAL
DETAIL
1
PIN 1 ID
(OPTIONAL)
28
25
28X
0.5
0.3
24
28X
0.3
0.2
0.1 C A B
0.05
NOTES:
4219075/A 11/2014
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
Copyright © 2015â2016, Texas Instruments Incorporated
www.ti.com
Product Folder Links: HD3SS460
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