CC2650 Datasheet, PDF (27/64 Pages) Texas Instruments – Multistandard Wireless MCU

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CC2650
SWRS158B – FEBRUARY 2015 – REVISED JULY 2016
DC Characteristics (continued)
PARAMETER
GPIO VOH at 8-mA load
GPIO VOL at 8-mA load
GPIO VOH at 4-mA load
GPIO VOL at 4-mA load
GPIO pullup current
GPIO pulldown current
GPIO high/low input transition,
no hysteresis
GPIO low-to-high input transition,
with hysteresis
GPIO high-to-low input transition,
with hysteresis
GPIO input hysteresis
VIH
VIL
TEST CONDITIONS
T_A = 25°C, V_DDS = 3.0 V
IOCURR = 2, high-drive GPIOs only
IOCURR = 2, high-drive GPIOs only
IOCURR = 1
IOCURR = 1
T_A = 25°C, V_DDS = 3.8 V
Input mode, pullup enabled, Vpad = 0 V
Input mode, pulldown enabled, Vpad = VDDS
IH = 0, transition between reading 0 and reading 1
IH = 1, transition voltage for input read as 0 → 1
IH = 1, transition voltage for input read as 1 → 0
IH = 1, difference between 0 → 1 and 1 → 0 points
T_A = 25°C
Lowest GPIO input voltage reliably interpreted as a
«High»
Highest GPIO input voltage reliably interpreted as a
«Low»
MIN TYP MAX UNIT
2.68
V
0.33
V
2.72
V
0.28
V
277
µA
113
µA
1.67
V
1.94
V
1.54
V
0.4
V
0.8 VDDS⁽¹⁾
0.2
VDDS ⁽¹⁾
(1) Each GPIO is referenced to a specific VDDS pin. See the technical reference manual listed in Section 8.3 for more details.
5.26 Thermal Resistance Characteristics
NAME
DESCRIPTION
RSM (°C/W)^{(1) (2)} RHB (°C/W)^{(1) (2)} RGZ (°C/W)^{(1) (2)}
Rθ_JA
Rθ_JC(top)
Rθ_JB
Psi_JT
Psi_JB
Rθ_JC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
36.9
32.8
29.6
30.3
24.0
15.7
7.6
6.8
6.2
0.4
0.3
0.3
7.4
6.8
6.2
2.1
1.9
1.9
(1) °C/W = degrees Celsius per watt.
(2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [Rθ_JC] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air).
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages.
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages.
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements.
Power dissipation of 2 W and an ambient temperature of 70ºC is assumed.
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