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BUF08630_14 Datasheet, PDF (27/35 Pages) Texas Instruments – Programmable Gamma-Voltage Generator and High Slew Rate VCOM
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VS
BUF08630
BUF08630
ESD Current
Steering
Diodes
Schottkey
Diode
OUTX
or
VCOM
External Capacitor
(not recommended)
SBOS515A – OCTOBER 2010 – REVISED AUGUST 2012
APPLICATION INFORMATION
Figure 37 shows a typical application circuit.
GENERAL POWERPAD DESIGN
CONSIDERATIONS
The BUF08630 is available in a thermally-enhanced
PowerPAD package. The exposed thermal die must
be soldered to the PCB using thermal vias. Refer to
Texas Instruments' application report SLAU271,
QFN/SON PCB Attachment.
Figure 36. Output Pins ESD Protection Current-
Steering Diodes
VCOM-VS
VS
VSH
10mF
D1(6)
VSD
0.1mF
Timing
Controller
0.1mF
10mF
R1(2)
R3(3)
R2(3)
SDA
A0
VSD
VCOM-GND
VCOM-OUT
BUF08630(1)
OUT6
OUT5
OUT4
OUT3
OUT2
0.1mF
0.1mF
R4(4)
R5(5)
10mF
OUT8
OUT7
OUT6
OUT5
OUT4
Source
Drivers
OUT3
OUT2
OUT1
10mF
LCD
Panel
(1) Exposed thermal pad must be connected to GND.
(2) R1 should be chosen for best stability.
(3) R2 and R3 are not needed if internal gain is used.
(4) R4 must not exceed 10 Ω.
(5) R5 must never be used. VCOM can provide up to 400mA. A 10-Ω resistor would cause a 4V drop to the device.
(6) D1 should be used if there is any possibility of VSH exceeding VS.
Figure 37. Typical Application Circuit
Copyright © 2010–2012, Texas Instruments Incorporated
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