BUF08630_14 Datasheet, PDF (2/35 Pages) Texas Instruments – Programmable Gamma-Voltage Generator and High Slew Rate VCOM

BUF08630
SBOS515A – OCTOBER 2010 – REVISED AUGUST 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PRODUCT
BUF08630
PACKAGE/ORDERING INFORMATION⁽¹⁾
PACKAGE
PACKAGE DESIGNATOR
VQFN-20
RGW
PACKAGE MARKING
BUF08630
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
Over operating free-air temperature range (unless otherwise noted).
V_S
Supply voltage V_SH
V_SD
Digital input pins, SCL, SDA, AO, BKSEL: voltage
Digital input pins, SCL, SDA, AO, BKSEL: current
Output pins, OUT1 through OUT4⁽²⁾
Output pins, OUT5 through OUT8⁽²⁾
V_COM ⁽²⁾
Output short-circuit⁽³⁾
Ambient operating temperature
Ambient storage temperature
Junction temperature, T_J
Human body model (HBM)
ESD ratings
Charged device model (CDM)
Machine model (MM)
BUF08630
+22
GND + 4.0 < V_SH < V_S – 4.0
+6
–0.5 to +6
±10
(V–) – 0.5 to (V_SH) + 0.5
(V_SH) – 0.5 to (V+) + 0.5
(V–) – 0.5 to (V+) + 0.5
Continuous
–40 to +95
–65 to +150
+125
4
1
200
UNIT
V
V
V
V
mA
V
V
V
°C
°C
°C
kV
kV
V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
(2) See the Output Protection section.
(3) Short-circuit to ground, one amplifier per package. Exposed thermal die is soldered to the printed circuit board (PCB) using thermal vias.
Refer to Texas Instruments' application report SLAU271, QFN/SON PCB Attachment.
THERMAL INFORMATION
THERMAL METRIC⁽¹⁾
θ_JA
θ_JC(top)
θ_JB
ψ_JT
ψ_JB
θ_JC(bottom)
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
BUF08630
RGW
20 PINS
42.4
34.4
10.4
8.2
42.4
2.1
UNITS
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
Submit Documentation Feedback
Product Folder Links: BUF08630
Copyright © 2010–2012, Texas Instruments Incorporated