OPA376 Datasheet, PDF (25/42 Pages) Burr-Brown (TI) – Precision, Low Noise, Low Quiescent Current, Operational Amplifier

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OPA376, OPA2376, OPA4376
SBOS406G – JUNE 2007 – REVISED DECEMBER 2015
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
The OPAx376 are specified for operation from 2.2 V to 5.5 V (±1.1 V to ±2.75 V); many specifications apply
from –40°C to +125°C. Parameters that can exhibit significant variance with regard to operating voltage or
temperature are presented in the Typical Characteristics.
The OPA2376YZD is a lead (Pb)-free, die-level, die-size ball grid array (DSBGA) package. Unlike devices that
are in plastic packages, these devices have no molding compound, lead frame, wire bonds, or leads. Using
standard surface-mount assembly procedures, the DSBGA can be mounted to a printed circuit board (PCB)
without additional underfill. Figure 33 and Figure 34 detail the pinout and package marking. See Application Note
SBVA017, NanoStar™ and NanoFree™ 300 μm Solder Bump WCSP, for more detailed information on package
characteristics and PCB design.
OPA2376YZD
Top View
(bump side down)
Not to Scale
+IN B D2
-IN B C2
OUT B B2
V+ A2
D1 V-
C1 +IN A
B1 ^{-IN A}
A1 OUT A
WCSP-8
Figure 33. Pin Description
OPA2376YZD
WCSP-8 Enlarged Image
Top View
(bump side down)
Actual Size:
Exact Size:
1.150mm x 2.188mm
Package Marking Code:
YMD = year/month/day
CGL = indicates OPA2376YZD
S = for engineering purposes only
Figure 34. Top-View Package Marking
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Product Folder Links: OPA376 OPA2376 OPA4376