THS3201_14 Datasheet, PDF (24/40 Pages) Texas Instruments – 1.8-GHz, LOW DISTORTION, CURRENT-FEEDBACK AMPLIFIER

THS3201
SLOS416C – JUNE 2003 – REVISED JUNE 2009 ............................................................................................................................................................. www.ti.com
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Table 2. Bill of Materials⁽¹⁾
DESCRIPTION
Bead, ferrite, 3 A, 80 Ω
Cap, 22 µF, tanatalum, 25 V, 10%
Cap, 100 pF, ceramic, 5%, 150 V
Cap, 0.1 µF, ceramic, X7R, 50 V
Open
Resistor, 49.9 Ω, 1/8 W, 1%
Resistor, 768 Ω, 1/8 W, 1%
Open
Resistor, 0 Ω, 1/4 W, 1%
Resistor, 49.9 Ω, 1/4 W, 1%
Test point, black
Open
Jack, Banana Receptance, 0.25” dia. hole
Connector, edge, SMA PCB jack
Standoff, 4-40 hex, 0.625” length
Screw, Phillips, 4-40, .250”
IC, THS3201
Board, printed circuit
THS3201DGN EVM
SMD SIZE REF DES
1206
D
AQ12
0805
0805
0805
0805
1206
1206
1206
FB1, FB2
C1, C2
C4, C5
C3, C6
R7
R6
R3, R5
C7, C8
R2
R4
TP1
J8, J9
J5, J6, J7
J1, J2, J4
U1
PCB MANUFACTURER'S
QUANTITY PART NUMBER
2
(Steward) HI1206N800R-00
2
(AVX) TAJD226K025R
2
(AVX) AQ12EM101JAJME
2
(AVX) 08055C104KAT2A
1
1
(Phycomp) 9C08052A49R9FKHFT
2
(Phycomp) 9C08052A7680FKHFT
2
1
(KOA) RK73Z2BLTD
1
(Phycomp) 9C12063A49R9FKRFT
1
(Keystone) 5001
2
3
(HH Smith) 101
3
(Johnson) 142-0701-801
4
(Keystone) 1804
4
SHR-0440-016-SN
1
(TI) THS3201DGN
1
(TI) Edge # 6447972 Rev.A
(1) The components shown in the BOM were used in test by TI.
blank space
Computer simulation of circuit performance using
SPICE is often useful when analyzing the
performance of analog circuits and systems. This is
particularly true for video and R_F-amplifier circuits
where parasitic capacitance and inductance can have
a major effect on circuit performance. A SPICE model
for the THS3201 family of devices is available
through the Texas Instruments web site (www.ti.com).
The Product Information Center (PIC) is available for
design assistance and detailed product information.
These models do a good job of predicting
small-signal ac and transient performance under a
wide variety of operating conditions. They are not
intended to model the distortion characteristics of the
amplifier, nor do they attempt to distinguish between
the package types in their small-signal ac
performance. Detailed information about what is and
is not modeled is contained in the model file itself.
ADDITIONAL REFERENCE MATERIAL
• PowerPAD Made Easy, application brief
(SLMA004)
• PowerPAD Thermally Enhanced Package,
technical brief (SLMA002)
• Voltage Feedback vs Current-Feedback Amplifiers
(SLVA051)
• Current-Feedback Analysis and Compensation
(SLOA021)
• Current-Feedback Amplifiers: Review, Stability,
and Application (SBOA081)
• Effect of Parasitic Capacitance in Op Amp Circuits
(SLOA013)
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