BUF20800-Q1 Datasheet, PDF (24/32 Pages) Texas Instruments – 18-CHANNEL GAMMA VOLTAGE GENERATOR WITH TWO PROGRAMMABLE VCOM CHANNELS

BUF20800-Q1
SBOS571 – AUGUST 2011
www.ti.com
5. When connecting these holes to the internal plane, do not use the typical web or spoke via connection
methodology. Web connections have a high thermal resistance connection that is useful for slowing the heat
transfer during soldering operations. This makes the soldering of vias that have plane connections easier. In
this application, however, low thermal resistance is desired for the most efficient heat transfer. Therefore, the
holes under the BUF20800-Q1 PowerPAD package should make their connection to the internal plane with a
complete connection around the entire circumference of the plated-through hole.
6. The top-side solder mask should leave the terminals of the package and the thermal pad area with its twelve
holes exposed. The bottom-side solder mask should cover the holes of the thermal pad area. This masking
prevents solder from being pulled away from the thermal pad area during the reflow process.
7. Apply solder paste to the exposed thermal pad area and all of the IC terminals.
8. With these preparatory steps in place, the BUF20800-Q1 IC is simply placed in position and run through the
solder reflow operation as any standard surfacemount component. This preparation results in a properly
installed part.
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