TMS320C6474_16 Datasheet, PDF (208/215 Pages) Texas Instruments – TMS320C6474 Multicore Digital Signal Processor

TMS320C6474
SPRS552H – OCTOBER 2008 – REVISED APRIL 2011
8 Mechanical Data
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8.1 Thermal Data
Table 8-1 shows the thermal resistance characteristics for the PBGA—CUN/GUN/ZUN—mechanical
package.
Table 8-1. Thermal Resistance Characteristics (PBGA Package) [CUN/GUN/ZUN]⁽¹⁾
NO.
PARAMETER
1
RΘ_JC
Junction-to-case
2
RΘ_JB
Junction-to-board
(1) A heatsink is required for proper device operation.
(2) m/s = meters per second
°C/W
0.30
6.5
AIR FLOW
(m/s) ⁽²⁾
N/A
N/A
8.2 Packaging Information
The following packaging information reflects the most current released data available for the designated
device(s). This data is subject to change without notice and without revision of this document.
208 Mechanical Data
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