THS1060_05 Datasheet, PDF (20/22 Pages) Texas Instruments – 10-BIT 60 MSPS IF SAMPLING COMMUNICATIONS

THS1060
10-BIT 60 MSPS IF SAMPLING COMMUNICATIONS
ANALOG-TO-DIGITAL CONVERTER
SLAS212A – MARCH 2000 – REVISED MARCH 2001
PHP (S-PQFP-G48)
MECHANICAL DATA
PowerPAD PLASTIC QUAD FLATPACK
0,50
36
0,27
0,17
25
0,08 M
37
24
Thermal Pad
(see Note D)
48
13
1
1,05
0,95
12
5,50 TYP
7,20
6,80 ^SQ
9,20
8,80 ^SQ
1,20 MAX
0,15
0,05
Seating Plane
0,08
0,13 NOM
Gage Plane
0,25
0°– 7°
0,75
0,45
4146927/A 01/98
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusions.
D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane. This pad is electrically
and thermally connected to the backside of the die and possibly selected leads.
E. Falls within JEDEC MO-153
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