HD3SS3212_16 Datasheet, PDF (20/26 Pages) Texas Instruments – Two-Channel Differential 2:1/1:2 USB3.1 Mux/Demux

HD3SS3212, HD3SS3212I
SLASE74C – MAY 2015 – REVISED JANUARY 2016
RKS0020A
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EXAMPLE BOARD LAYOUT
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
20X (0.6)
2
20X (0.25)
(1)
SYMM
1
20
19
SYMM
16X (0.5)
(R0.05) TYP
(1.25)
(3)
(4.3)
9
12
( 0.2) VIA
TYP
10 11
(2.3)
LAND PATTERN EXAMPLE
SCALE:20X
0.07 MAX
ALL AROUND
METAL
0.07 MIN
ALL AROUND
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4222490/A 10/2015
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations are shown.
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20
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