HD3SS3212_16 Datasheet, PDF (19/26 Pages) Texas Instruments – Two-Channel Differential 2:1/1:2 USB3.1 Mux/Demux

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RKS0020A
SCALE 3.300
A
2.6
2.4
B
PIN 1 INDEX AREA
4.6
4.4
HD3SS3212, HD3SS3212I
SLASE74C – MAY 2015 – REVISED JANUARY 2016
PACKAGE OUTLINE
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
1 MAX
0.05
0.00
1±0.1
2X 0.5
14X 0.5
10
9
11
12
C
SEATING PLANE
0.08
EXPOSED
THERMAL PAD
2X
3.5
3±0.1
(0.2) TYP
2
PIN 1 ID
(OPTIONAL)
1 20
20X
0.5
0.3
19
20X
0.3
0.2
0.1 C A B
0.05
NOTES:
4222490/A 10/2015
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
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