DRV8821_16 Datasheet, PDF (20/32 Pages) Texas Instruments – Dual Stepper Motor Controller and Driver

DRV8821
SLVS912J – JANUARY 2009 – REVISED JANUARY 2016
10 Layout
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10.1 Layout Guidelines
The bulk capacitor should be placed to minimize the distance of the high-current path through the motor driver
device. The connecting metal trace widths should be as wide as possible, and numerous vias should be used
when connecting PCB layers. These practices minimize inductance and allow the bulk capacitor to deliver high
current.
Small-value capacitors should be ceramic, and placed closely to device pins.
The high-current device outputs should use wide metal traces.
The device thermal pad should be soldered to the PCB top-layer ground plane. Multiple vias should be used to
connect to a large bottom-layer ground plane. The use of large metal planes and multiple vias help dissipate the
I² × R_DS(on) heat that is generated in the device.
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