TLC59282_15 Datasheet, PDF (2/24 Pages) Texas Instruments – 16-Channel, Constant-Current LED Driver with 4-Channel Grouped Delay

TLC59282
SBVS152C – DECEMBER 2010 – REVISED OCTOBER 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PRODUCT
TLC59282
TLC59282
PACKAGE/ORDERING INFORMATION⁽¹⁾
PACKAGE-LEAD
ORDERING NUMBER
SSOP-24/QSOP-24
TLC59282DBQR
TLC59282DBQ
QFN-24
TLC59282RGER
TLC59282RGE
TRANSPORT MEDIA, QUANTITY
Tape and Reel, 2500
Tube, 50
Tape and Reel, 3000
Tape and Reel, 250
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾⁽²⁾
Over operating free-air temperature range, unless otherwise noted.
PARAMETER
V_CC
I_OUT
V_IN
V_OUT
Supply voltage
Output current (dc)
Input voltage range
Output voltage range
OUT0 to OUT15
SIN, SCLK, LAT, BLANK, IREF
SOUT
OUT0 to OUT15
T_J(MAX)
T_STG
Operating junction temperature
Storage temperature range
ESD rating
Human body model (HBM)
Charged device model (CDM)
TLC59282
–0.3 to +6
50
–0.3 to V_CC + 0.3
–0.3 to V_CC + 0.3
–0.3 to +18
+150
–55 to +150
4000
1000
UNIT
V
mA
V
V
V
°C
°C
V
V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
(2) All voltage values are with respect to network ground terminal.
THERMAL INFORMATION
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
THERMAL METRIC⁽¹⁾
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
TLC59282
DBQ
RGE
24 PINS
24 PINS
73.2
46.8
44.6
48.6
38.9
23.0
12.3
1.2
39.7
22.9
n/a
6.3
UNITS
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
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