THS6092 Datasheet, PDF (2/23 Pages) Texas Instruments – 275mA, 12 V ADSL CPE LINE DRIBERS

THS6092, THS6093
275 mA, +12 V ADSL CPE LINE DRIVERS
SLOS345C − JANUARY 2001 − REVISED OCTOBER 2002
AVAILABLE OPTIONS
PACKAGED DEVICE
TA
SOIC-8†
(D)
SOIC-8†
PowerPAD
(DDA)
SOIC-14†
(D)
TSSOP-14†
PowerPAD
(PWP)
0°C to 70°C
THS6092CD
THS6092CDDA
THS6093CD
THS6093CPWP
−40°C to 85°C
THS6092ID
THS6092IDDA
THS6093ID
THS6093IPWP
† _{All packages are available taped and reeled. Add an R-suffix to the device type (i.e., THS6092IDR).}
EVALUATION
MODULES
THS6092EVM
THS6093EVM
—
absolute maximum ratings over operating free-air temperature (unless otherwise noted)^†
Supply voltage, V_CC+ to V_{CC −} . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14.7 V
Input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± V_CC
Output current (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 350 mA
Differential input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 3 V
Maximum junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Total power dissipation at (or below) 25°C free-air temperature . . . . . . . . . . . See Dissipation Ratings Table
Operating free-air temperature, T_A: Commercial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C
Storage temperature, T_stg : Commercial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 125°C
Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 125°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
† _{Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and}
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The THS6092 and THS6093 may incorporate a PowerPAD on the underside of the chip. This acts as a heatsink and must be
connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction
temperature which could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the
PowerPAD thermally enhanced package.
DISSIPATION RATING TABLE
PACKAGE
θ_JA
θ_JC
TA = 25°C§
POWER RATING
TA = 70°C§
POWER RATING
TA = 85°C§
POWER RATING
D-8
95°C/W‡
38.3°C/W‡
1.1 W
0.63 W
0.47 W
DDA
45.8°C/W
9.2°C/W
2.3 W
1.31 W
0.98 W
D-14
66.6°C/W‡
26.9°C/W‡
1.6 W
0.90 W
0.68 W
PWP
37.5°C/W
1.4°C/W
2.8 W
1.60 W
1.20 W
‡ _{This data was taken using the JEDEC proposed high-K test PCB. For the JEDEC low-K test PCB, the ΘJA is168°C/W for the D−8 package and}
122.3°C/W for the D−14 package.
§ _{Power rating is determined with a junction temperature of 130°C. This is the point where distortion starts to substantially increase. Thermal}
management of the final PCB should strive to keep the junction temperature at or below 125°C for best performance.
recommended operating conditions
Supply voltage, VCC+ to VCC−
Operating free-air temperature, TA
Dual supply
Single supply
C-suffix
I-suffix
MIN
± 2.5
+5
0
−40
NOM
MAX
±7
+14
70
85
UNIT
V
°C
2
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