THS3115CPWP Datasheet, PDF (2/35 Pages) Texas Instruments – LOW-NOISE, HIGH-SPEED, CURRENT FEEDBACK AMPLIFIERS

THS3112
THS3115
SLOS385C – SEPTEMBER 2001 – REVISED SEPTEMBER 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
T_A
0°C to +70°C
40°C to +85°C
SOIC-8
(D)
THS3112CD
THS3112ID
AVAILABLE OPTIONS⁽¹⁾
PACKAGED DEVICE
SOIC-8 PowerPAD
(DDA)
SOIC-14
(D)
THS3112CDDA
THS3115CD
THS3112IDDA
THS3115ID
TSSOP-14
(PWP)
THS3115CPWP
THS3115IPWP
EVALUATION
MODULES
THS3112EVM
THS3115EVM
(1) For the most current specification and package information, refer to the Package Option Addendum located at the end of this data sheet
or see the TI web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
Over operating free-air temperature (unless otherwise noted).
Supply voltage, V_CC+ to V_CC–
Input voltage
Output current (see ⁽²⁾)
Differential input voltage
Maximum junction temperature
Total power dissipation at (or below) +25°C free-air temperature
Operating free-air temperature, T_A
Commercial
Industrial
Storage temperature, T_stg
Commercial
Industrial
UNIT
33 V
±V_CC
275 mA
±4 V
+150°C
See Dissipation Ratings Table
0°C to +70°C
–40°C to +85°C
–65°C to +125°C
–65°C to +125°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The THS3122 and THS3125 may incorporate a PowerPAD™ on the underside of the chip. This pad acts as a heatsink and must be
connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction
temperature which could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the
PowerPAD™ thermally-enhanced package.
DISSIPATION RATINGS TABLE
PACKAGE
D-8
q_JA
95°C/W ⁽¹⁾
T_A = +25°C
POWER RATING
1.32 W
DDA
D-14
67°C/W
66.6°C/W ⁽¹⁾
1.87 W
1.88 W
PWP
37.5°C/W
3.3 W
(1) These data were taken using the JEDEC proposed high-K test PCB.
For the JEDEC low-K test PCB, the q_JA is 168°C/W for the D-8
package and 122.3°C/W for the D-14 package.
2
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