THS3115CPWP Datasheet, PDF (18/35 Pages) Texas Instruments – LOW-NOISE, HIGH-SPEED, CURRENT FEEDBACK AMPLIFIERS

THS3112
THS3115
SLOS385C – SEPTEMBER 2001 – REVISED SEPTEMBER 2010
For systems where heat dissipation is more critical,
the THS3115 and THS3112 are also available in an
8-pin MSOP with PowerPAD package that offers
even better thermal performance. The thermal
coefficient for the PowerPAD packages are
substantially improved over the traditional SOIC.
Maximum power dissipation levels are depicted in
Figure 52 for the available packages. The data for the
PowerPAD packages assume a board layout that
follows the PowerPAD layout guidelines discussed
above and detailed in the PowerPAD application note
(literature number SLMA002). Figure 52 also
illustrates the effect of not soldering the PowerPAD to
a PCB. The thermal impedance increases
substantially, which may cause serious heat and
performance issues. Always solder the PowerPAD to
the PCB for optimum performance.
When determining whether or not the device satisfies
the maximum power dissipation requirement, it is
important to not only consider quiescent power
dissipation, but also dynamic power dissipation. Often
times, this type of dissipation is difficult to quantify
because the signal pattern is inconsistent, but an
estimate of the RMS power dissipation can provide
visibility into a possible problem.
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4.0
T_J = +125°C
3.5
3.0
q_JA = 58.4°C/W
2.5
2.0
q_JA = 95°C/W
1.5
1.0
0.5
q_JA = 158°C/W
0
-40 -20
0
20
40
60
80 100
T_A - Free-Air Temperature (°C)
Results shown are with no air flow and PCB size of 3 in × 3 in
(76,2 mm × 76,2 mm).
• q_JA = 58.4°C/W for 8-pin MSOP with PowerPAD (DGN
package)
• q_JA = 95°C/W for 8-pin SOIC High-K test PCB (D package)
• q_JA = 158°C/W for 8-pin MSOP with PowerPAD without solder
Figure 52. Maximum Power Dissipation vs
Ambient Temperature
18
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