ONET8551T Datasheet, PDF (2/16 Pages) Texas Instruments – 11.3-Gbps Limiting Transimpedance Amplifier With RSSI

ONET8551T
SLLSEI5 – OCTOBER 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
Bond Pad Assignment of ONET8551T
(TOP VIEW)
GND
OUT+
GND
8551T
20 19 18 17
1
16
2
15
3
14
GND
OUT±
GND
VCC_OUT
VCC_IN
4
13
5
12
6 7 8 9 10 11
RSSI_EB
RSSI_IB
Figure 1. The ONET8551T is available in die form. Bond pad locations are shown in this top view.
Table 1. BOND PAD DESCRIPTION
Pad
Symbol
Type
1, 3, 6, 10, 14,
16, 18, 19
GND
Supply
2
OUT+ Analog output
4
VCC_OUT Supply
5
VCC_IN Supply
7, 9
FILTER Analog
8
IN
Analog input
11
NC No connect
12
RSSI_IB Analog output
13
RSSI_EB Analog output
15
17
20
Back-side of
die
OUT–
BW1
BW0
GND
Analog output
Digital input
Digital input
Supply
Description
Circuit ground. All GND pads are connected on die. Bonding all pads is optional. However,
for optimum performance, a good ground connection is mandatory.
Non-inverted CML data output; on-chip 50-Ω back-terminated to V_CC
2.8-V to 3.63-V supply voltage for AGC amplifier
2.8-V to 3.63-V supply voltage for input TIA stage
Bias voltage for photodiode cathode
Data input to TIA (photodiode anode)
Do not connect
Analog output current is proportional to the input data amplitude. It indicates the strength of
the received signal (RSSI), if the photodiode is biased from the TIA. Connected to an external
resistor to ground (GND). For proper operation, ensure that the voltage at the RSSI pad does
not exceed V_CC – 0.65 V. Leave this pad open if the RSSI feature is not used.
Optional use when operated with external PD bias (e.g. APD). Analog output current
proportional to the input data amplitude. Indicates the strength of the received signal (RSSI).
Connected to an external resistor to ground (GND). For proper operation, ensure that the
voltage at the RSSI pad does not exceed V_CC – 0.65 V. Leave this pad open if the RSSI
feature is not used.
Inverted CML data output; on-chip 50-Ω back-terminated to V_CC.
Bandwidth adjustment. Ground the pad to increase the bandwidth. Internally pulled-up to V_CC
Bandwidth adjustment. Ground the pad to increase the bandwidth. Internally pulled-up to V_CC
Conductive epoxy must be used to attach the die to ground.
2
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