MSP430F22X2_17 Datasheet, PDF (2/94 Pages) Texas Instruments – MIXED SIGNAL MICROCONTROLLER

MSP430F22x2
MSP430F22x4
SLAS504G – JULY 2006 – REVISED AUGUST 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
DESCRIPTION
The Texas Instruments MSP430™ family of ultra-low-power microcontrollers consist of several devices featuring
different sets of peripherals targeted for various applications. The architecture, combined with five low-power
modes is optimized to achieve extended battery life in portable measurement applications. The device features a
powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency.
The digitally controlled oscillator (DCO) allows wake-up from low-power modes to active mode in less than 1 µs.
The MSP430F22x4/MSP430F22x2 series is an ultra-low-power mixed signal microcontroller with two built-in 16-
bit timers, a universal serial communication interface, 10-bit A/D converter with integrated reference and data
transfer controller (DTC), two general-purpose operational amplifiers in the MSP430F22x4 devices, and 32 I/O
pins.
Typical applications include sensor systems that capture analog signals, convert them to digital values, and then
process the data for display or for transmission to a host system. Stand-alone radio-frequency (RF) sensor front
ends are another area of application.
T_A
-40°C to 85°C
-40°C to 105°C
Table 1. Available Options
PACKAGED DEVICES⁽¹⁾⁽²⁾
PLASTIC 49-PIN BGA
(YFF)
PLASTIC 38-PIN TSSOP
(DA)
MSP430F2232IYFF
MSP430F2232IDA
MSP430F2252IYFF
MSP430F2252IDA
MSP430F2272IYFF
MSP430F2272IDA
MSP430F2234IYFF
MSP430F2234IDA
MSP430F2254IYFF
MSP430F2254IDA
MSP430F2274IYFF
MSP430F2274IDA
MSP430F2232TDA
MSP430F2252TDA
MSP430F2272TDA
MSP430F2234TDA
MSP430F2254TDA
MSP430F2274TDA
PLASTIC 40-PIN QFN
(RHA)
MSP430F2232IRHA
MSP430F2252IRHA
MSP430F2272IRHA
MSP430F2234IRHA
MSP430F2254IRHA
MSP430F2274IRHA
MSP430F2232TRHA
MSP430F2252TRHA
MSP430F2272TRHA
MSP430F2234TRHA
MSP430F2254TRHA
MSP430F2274TRHA
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
Development Tool Support
All MSP430™ microcontrollers include an Embedded Emulation Module (EEM) that allows advanced debugging
and programming through easy-to-use development tools. Recommended hardware options include:
• Debugging and Programming Interface
– MSP-FET430UIF (USB)
– MSP-FET430PIF (Parallel Port)
• Debugging and Programming Interface with Target Board
– MSP-FET430U38 (DA package)
• Production Programmer
– MSP-GANG430
2
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