LMH6551MAX_NOPB Datasheet, PDF (2/28 Pages) Texas Instruments – LMH6551 Differential, High Speed Op Amp

LMH6551
SNOSAK7C – FEBRUARY 2005 – REVISED MARCH 2013
Connection Diagram
1
-IN
2
V_CM
3
V+
+OUT ⁴
-+
8
+IN
7 _NC
6 _V-
5 _-OUT
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Figure 2. 8-Pin SOIC & VSSOP - Top View
See Package Number D0008A and DGK0008A
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings ⁽¹⁾⁽²⁾
ESD Tolerance ⁽³⁾
Human Body Model
Machine Model
Supply Voltage
Common Mode Input Voltage
Maximum Input Current (pins 1, 2, 7, 8)
Maximum Output Current (pins 4, 5)
Maximum Junction Temperature
Soldering Information
See Product Folder at www.ti.com and SNOA549
2000V
200V
13.2V
±Vs
30mA
(4)
150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical
Characteristics tables.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Human body model: 1.5 kΩ in series with 100 pF. Machine model: 0Ω in series with 200pF.
(4) The maximum output current (I_OUT) is determined by device power dissipation limitations.
Operating Ratings ⁽¹⁾
Operating Temperature Range
Storage Temperature Range
Total Supply Voltage
Package Thermal Resistance (θ_JA) ⁽²⁾
8-Pin VSSOP
8-Pin SOIC
−40°C to +125°C
−65°C to +150°C
3V to 12V
235°C/W
150°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical
Characteristics tables.
(2) The maximum power dissipation is a function of T_J(MAX), θ_JA and T_A. The maximum allowable power dissipation at any ambient
temperature is P _D= (T_J(MAX) — T_A)/ θ_JA. All numbers apply for package soldered directly into a 2 layer PC board with zero air flow.
2
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