LMH2120 Datasheet, PDF (2/34 Pages) National Semiconductor (TI) – Linear RMS power detector particularly suited for accurate

LMH2120
SNWS021C – JULY 2010 – REVISED FEBRUARY 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings ⁽¹⁾⁽²⁾
Supply Voltage
V_DD - GND
RF Input
Input power
DC Voltage
Enable (EN) Input Voltage
ESD Tolerance ⁽³⁾
Human Body Model
Machine Model
Charge Device Model
Storage Temperature Range
Junction Temperature ⁽⁴⁾
For soldering specifications:
See product folder at www.ti.com and SNOA549
5.5V
12 dBm
1V
GND-0.4V < V_EN and V_EN<Min (V_DD+0.4, 3.6V)
2000V
200V
1000V
−65°C to 150°C
150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Human body model, applicable std. MIL-STD-883, Method 3015.7. Machine model, applicable std. JESD22–A115–A (ESD MM std of
JEDEC). Field-Induced Charge-Device Model, applicable std. JESD22–C101–C. (ESD FICDM std. of JEDEC)
(4) The maximum power dissipation is a function of T_J(MAX) , θ_JA. The maximum allowable power dissipation at any ambient temperature is
P_D = (T_J(MAX) - T_A)/θ_JA. All numbers apply for packages soldered directly into a PC board.
Operating Ratings ⁽¹⁾
Supply Voltage
2.7V to 5V
Temperature Range
−40°C to +85°C
RF Frequency Range
50 MHz to 6 GHz
RF Input Power Range
Package Thermal Resistance θ_JA(2)
−35 dBm to 5 dBm
166.7°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) The maximum power dissipation is a function of T_J(MAX) , θ_JA. The maximum allowable power dissipation at any ambient temperature is
P_D = (T_J(MAX) - T_A)/θ_JA. All numbers apply for packages soldered directly into a PC board.
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