LMH1981 Datasheet, PDF (2/24 Pages) National Semiconductor (TI) – Multi-Format Video Sync Separator

LMH1981
SNLS214H – APRIL 2006 – REVISED MARCH 2013
Pin No.
1
2, 5, 10
3, 6, 11
4
7
8
9
12
13
14
Pin Name
R_EXT
GND
V_CC
V_IN
HSOUT
VSOUT
VFOUT
CSOUT
BPOUT
OEOUT
PIN DESCRIPTIONS
Pin Description
Bias Current External Resistor
Ground
Supply Voltage
Video Input
Horizontal Sync Output
Vertical Sync Output
Video Format Output
Composite Sync Output
Burst/Back Porch Timing Output
Odd/Even Field Output
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings ^(1)(2)(3)
ESD Tolerance ⁽⁴⁾
Human Body Model
3.5 kV
Machine Model
350V
Charge-Device Model
1.0 kV
Supply Voltage, V_CC
Video Input, V_IN
Storage Temperature Range
0V to 5.5V
−0.3V to V_CC + 0.3V
−65°C to +150°C
Lead Temperature (soldering 10 sec.)
Junction Temperature (T_JMAX) ⁽⁵⁾
Thermal Resistance (θ_JA)
300°C
+150°C
52°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics Tables.
(2) All voltages are measured with respect to GND, unless otherwise specified.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(4) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(5) The maximum power dissipation is a function of T_J(MAX), θ_JA. The maximum allowable power dissipation at any ambient temperature is
P_D = (T_J(MAX) - T_A)/θ_JA . All numbers apply for packages soldered directly onto a PC board.
Operating Ratings ⁽¹⁾
Temperature Range ⁽²⁾
−40°C to +85°C
V_CC
Input Amplitude, V_IN-AMPL
3.3V −5% to 5V +5%
140 mV to V_CC–V_IN-CLAMP
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics Tables.
(2) The maximum power dissipation is a function of T_J(MAX), θ_JA. The maximum allowable power dissipation at any ambient temperature is
P_D = (T_J(MAX) - T_A)/θ_JA . All numbers apply for packages soldered directly onto a PC board.
2
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