LMC6035 Datasheet, PDF (2/29 Pages) National Semiconductor (TI) – Low Power 2.7V Single Supply CMOS Operational Amplifiers

LMC6035, LMC6035-Q1, LMC6036
SNOS875G – JANUARY 2000 – REVISED APRIL 2013
www.ti.com
Bump Number
A1
B1
C1
C2
C3
B3
A3
A2
Table 1. DSBGA Connection Table
OUTPUT A
IN A^−
IN A⁺
V^−
IN B⁺
IN B^−
OUTPUT B
V⁺
LM6035IBP
LMC6035IBPX
OUTPUT B
V⁺
OUTPUT A
IN A^−
IN A⁺
V^−
IN B⁺
IN B^−
LMC6035ITL
LMC6035ITLX
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings⁽¹⁾⁽²⁾
ESD Tolerance⁽³⁾
Differential Input Voltage
Supply Voltage (V⁺ − V^−)
Output Short Circuit to V ⁺
Output Short Circuit to V ^−
Lead Temperature (soldering, 10 sec.)
Current at Output Pin
Current at Input Pin
Current at Power Supply Pin
Storage Temperature Range
Junction Temperature⁽⁶⁾
Human Body Model (LMC6035, LMC6036)
Human Body Model (LMC6035-Q1)
Machine Model
3000V
2000V
300V
± Supply Voltage
16V
See ⁽⁴⁾
See ⁽⁵⁾
260°C
±18mA
±5mA
35mA
−65°C to +150°C
150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3) Human body model, 1.5kΩ in series with 100pF.
(4) Do not short circuit output to V⁺ when V⁺ is greater than 13V or reliability will be adversely affected.
(5) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of 30mA over long term may adversely affect
reliability.
(6) The maximum power dissipation is a function of T_J(MAX), θ_JA, and T_A. The maximum allowable power dissipation at any ambient
temperature is P_D = (T_J(MAX) −T_A)/θ _JA. All numbers apply for packages soldered directly onto a PC board with no air flow.
Operating Ratings⁽¹⁾
Supply Voltage
Temperature Range
Thermal Resistance (θ_JA)
LMC6035I and LMC6036I
8-pin VSSOP
8-pin SOIC
14-pin SOIC
14-pin TSSOP
8-Bump (6 mil) DSBGA
8-Bump (12 mil) Thin DSBGA
2.0V to 15.5V
−40°C ≤ T _J ≤ +85°C
230°C/W
175°C/W
127°C/W
137°C/W
220°C/W
220°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
2
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