DAC900-Q1 Datasheet, PDF (2/26 Pages) Texas Instruments – 10-BIT 165-MSPS DIGITAL-TO-ANALOG CONVERTER

DAC900-Q1
SBAS505 – JUNE 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
+V_A
DAC900
FSA
REF_IN
INT/EXT
BW
+V_D
Current
Sources
LSB
Switches
Segmented
Switches
I_OUT
I_OUT
BYP
+1.24V Ref.
AGND
CLK
Latches
PD
10-Bit Data Input
D9...D0
DGND
T_A
–40°C to 105°C
TSSOP – PW
ORDERING INFORMATION⁽¹⁾
PACKAGE ⁽²⁾
ORDERABLE PART NUMBER
Reel of 2500
DAC900TPWRQ1
TOP-SIDE MARKING
DAC900T
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
+V_A to AGND
+V_D to DGND
AGND to DGND
+V_A to +VD
CLK, PD to DGND
D0-D9 to DGND
IOUT, IOUT to AGND
BW, BYP to AGND
REFIN, FSA to AGND
INT/EXT to AGND
Junction temperature
Storage temperature
–0.3V to +6V
–0.3V to +6V
–0.3V to +0.3V
–6V to +6V
–0.3V to V_D + 0.3V
–0.3V to V_D + 0.3V
–1V to V_A + 0.3V
–0.3V to V_A + 0.3V
–0.3V to V_A + 0.3V
–0.3V to V_A + 0.3V
+150°C
+150°C
2
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