DAC8811ICDGKT Datasheet, PDF (2/21 Pages) Texas Instruments – 16-Bit, Serial Input Multiplying Digital-to-Analog Converter

DAC8811
SLAS411B – NOVEMBER 2004 – REVISED FEBRUARY 2007
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
PACKAGE/ORDERING INFORMATION⁽¹⁾
PRODUCT
DAC8811C
DAC8811C
DAC8811C
DAC8811C
DAC8811B
DAC8811B
DAC8811B
DAC8811B
MINIMUM
RELATIVE
ACCURACY
(LSB)
±1
±1
±1
±1
±2
±2
±2
±2
DIFFERENTIAL
NONLINEARITY
(LSB)
±1
±1
±1
±1
±1
±1
±1
±1
PACKAGE-
LEAD
(DESIGNATOR)
MSOP-8 (DGK)
MSOP-8 (DGK)
SON-8 (DRB)
SON-8 (DRB)
MSOP-8 (DGK)
MSOP-8 (DGK)
SON-8 (DRB)
SON-8 (DRB)
SPECIFIED
TEMPERATURE
RANGE
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
PACKAGE
MARKING
D11
D11
D11
D11
D11
D11
D11
D11
ORDERING
NUMBER
DAC8811ICDGKT
DAC8811ICDGKR
DAC8811ICDRBT
DAC8811ICDRBR
DAC8811IBDGKT
DAC8811IBDGKR
DAC8811IBDRBT
DAC8811IBDRBR
TRANSPORT
MEDIA,
QUANTITY
Tape and Reel, 250
Tape and Reel, 2500
Tape and Reel, 250
Tape and Reel, 2500
Tape and Reel, 250
Tape and Reel, 2500
Tape and Reel, 250
Tape and Reel, 2500
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
V_DD to GND
Digital input voltage to GND
V (I_OUT) to GND
Operating temperature range
V_REF, R_FB to GND
Storage temperature range
Junction temperature range (T_J max)
Power dissipation
Thermal impedance, R_ΘJA
Lead temperature, soldering
Vapor phase (60s)
Lead temperature, soldering
Infrared (15s)
ESD rating, HBM
ESD rating, CDM
DAC8811
–0.3 to 7
–0.3 to +V_DD + 0.3
–0.3 to +V_DD + 0.3
–40 to 105
–25 to 25
–65 to 150
125
(T_J max – T_A) / R_ΘJA
55
215
220
4000
1000
UNIT
V
V
V
°C
V
°C
°C
W
°C/W
°C
°C
V
V
(1) Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
2
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