CD74HC4017-Q1 Datasheet, PDF (2/14 Pages) Texas Instruments – HIGH-SPEED CMOS LOGIC DECADE COUNTER/DIVIDER WITH 10 DECODED OUTPUTS

CD74HC4017-Q1
HIGH-SPEED CMOS LOGIC DECADE COUNTER/DIVIDER
WITH 10 DECODED OUTPUTS
SCLS546SA − OCTOBER 2003 − REVISED APRIL 2008
logic diagram (positive logic)
14
CP
13
CE
15
MR
30
21
42
73
10 ₄
15
56
67
98
11 ₉
12 _TC
Decoded
Decimal
Out
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)^†
Supply voltage range, V_CC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input clamp current, I_IK (V_I < −0.5 V or V_I > V_CC + 0.5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, I_OK (V_O < −0.5 V or V_O > V_CC + 0.5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Source or sink current per output pin, I_O (V_O > −0.5 V or V_O < V_CC + 0.5 V) . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through V_CC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θ_JA (see Note 2): M package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
Maximum junction temperature, T_J . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Lead temperature (during soldering):
At distance 1/16 ± 1/32 inch (1,59 ± 0,79 mm) from case for 10 s max . . . . . . . . . . . . . . . . . . . . . . . 300°C
Storage temperature range, T_stg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† _{Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and}
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages referenced to GND unless otherwise specified.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
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