BQ29200_16 Datasheet, PDF (2/24 Pages) Texas Instruments – Voltage Protection with Automatic Cell Balance

bq29200, bq29209
SLUSA52C – SEPTEMBER 2010 – REVISED MARCH 2016
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Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Device Options....................................................... 4
6 Pin Configuration and Functions ......................... 4
7 Specifications......................................................... 4
7.1 Absolute Maximum Ratings ...................................... 4
7.2 ESD Ratings.............................................................. 5
7.3 Recommended Operating Conditions....................... 5
7.4 Thermal Information .................................................. 5
7.5 Electrical Characteristics........................................... 5
7.6 Recommended Cell Balancing Configurations ......... 7
7.7 Typical Characteristics .............................................. 7
8 Detailed Description .............................................. 8
8.1 Overview ................................................................... 8
8.2 Functional Block Diagram ......................................... 8
8.3 Feature Description................................................... 8
8.4 Device Functional Modes........................................ 12
9 Application and Implementation ........................ 13
9.1 Application Information............................................ 13
9.2 Typical Applications ................................................ 13
9.3 System Example ..................................................... 14
10 Power Supply Recommendations ..................... 14
11 Layout................................................................... 15
11.1 Layout Guidelines ................................................. 15
11.2 Layout Example .................................................... 15
12 Device and Documentation Support ................. 16
12.1 Related Links ........................................................ 16
12.2 Community Resources.......................................... 16
12.3 Trademarks ........................................................... 16
12.4 Electrostatic Discharge Caution ............................ 16
12.5 Glossary ................................................................ 16
13 Mechanical, Packaging, and Orderable
Information ........................................................... 16
4 Revision History
Changes from Revision B (December 2014) to Revision C
Page
• Changed Typical Application title to Simplified Schematic .................................................................................................... 1
• Changed resistor R_VD location, added PACK+ and PACK- in the Simplified Schematic image ............................................ 1
• Deleted the Lead Temperature (soldering) from the Absolute Maximum Ratings table ....................................................... 4
• Deleted table notes 2 through 7 from the Thermal Information.............................................................................................. 5
• Changed resistor R_VD location in Figure 9 ........................................................................................................................... 13
• Added title to Table 1............................................................................................................................................................ 13
• Changed resistor R_VD location, added PACK+ and PACK- in Figure 11 ............................................................................ 14
Changes from Revision A (September 2010) to Revision B
Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section .................................................................................................. 1
2
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