AMC1204_14 Datasheet, PDF (2/37 Pages) Texas Instruments – 20MHz, Second-Order, Isolated Delta-Sigma Modulator for Current-Shunt Measurement

AMC1204
AMC1204B
SBAS512D – APRIL 2011 – REVISED DECEMBER 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
For the most current package and ordering information see the Package Option Addendum at the end of this
document, or visit the device product folder on www.ti.com.
PART NUMBER
AMC1203
AMC1203B
AMC1204
AMC1204B
MODULATOR
CLOCK (MHz)
10
10
20
20
FAMILY OVERVIEW
DIGITAL
SUPPLY
CLOCK SOURCE
INL (LSB)
5V
Internal
±9
5V
Internal
±6
3V, 3.3V, or 5V
External
±8
3V, 3.3V, or 5V
External
±8
GAIN ERROR
(%)
±2
±1
±2
±2
THD (dB)
–84.5
–88
–80
–80
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
Over the operating ambient temperature range, unless otherwise noted.
PARAMETER
Supply voltage, AVDD to AGND or DVDD to DGND
Analog input voltage at VINP, VINN
Digital input voltage at CLKIN
Input current to any pin except supply pins
Maximum virtual junction temperature, T_J
Operating ambient temperature range, T_OA
Human body model (HBM)
JEDEC standard 22, test method A114-C.01
Electrostatic discharge (ESD),
all pins
Charged device model (CDM)
JEDEC standard 22, test method C101
Machine model (MM)
JEDEC standard 22, test method A115A
AMC1204, AMC1204B
MIN
MAX
–0.3
+6
AGND – 0.5
AVDD + 0.5
DGND – 0.3
DVDD + 0.3
–10
+10
+150
–40
+125
–3000
+3000
–1500
+1500
–200
+200
UNIT
V
V
V
mA
°C
°C
V
V
V
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under the Electrical Characteristics
is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
THERMAL METRIC⁽¹⁾
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
AMC1204, AMC1204B
DW
DWV
16 PINS
8 PINS
78.5
106.5
41.3
53.6
50.2
60.3
11.5
18.5
41.2
58.9
n/a
n/a
UNITS
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
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