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HD3SS2522 Datasheet, PDF (16/25 Pages) Texas Instruments – USB Type-C SS MUX | |||
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HD3SS2522
SLLSEM6B â APRIL 2015 â REVISED AUGUST 2015
Layout Guidelines (continued)
⢠Place vias as close as possible to the decoupling cap solder pad.
⢠Widen VCC/GND planes to reduce effect of static and dynamic IR drop.
⢠The VBUS traces/planes must be wide enough to carry max current for the application.
10.2 Layout Example
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A0p
A0n
To USB
Host/Hub
A1p
A1n
B0p
B0n
B1p
B1n
To TypeC
Connector
C0p
C0n
C1p
C1n
Thermal PAD
Figure 5. Layout
16
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