ADC08DL500_15 Datasheet, PDF (10/57 Pages) Texas Instruments – Low Power, 8-Bit, Dual 500 MSPS A/D Converter

ADC08DL500
SNAS495C – MARCH 2011 – REVISED MARCH 2011
www.ti.com
Operating Ratings ^{(1) (2)} (continued)
Ambient Temperature Range ⁽³⁾
Supply Voltage (V_A)
Driver Supply Voltage (V_DR)
Common Mode Input Voltage
V_IN+, V_IN− Voltage Range (Maintaining Common Mode)
−40°C ≤ T_A ≤ +70°C
+1.8V to +2.0V
+1.8V to V_A
V_CMO ± 50 mV
0V to 2.15V
(100% duty cycle)
0V to 2.5V
(10% duty cycle)
Ground Difference
(|GND − DR GND|)
0V
CLK Pins Voltage Range
Differential CLK Amplitude
Common Mode Input Voltage
0V to V_A
0.4V_P-P to 2.0V_P-P
V_CMO - 50mV < V_CMI < V_CMO + 50mV
(3) The 4-layer standard JEDEC thermal test board or 4LJEDEC is 4"x3" in size. The board has two embedded copper layers which cover
roughly the same size as the board. The copper thickness for the four layers, starting from the top one, is 2 oz., 1 oz., 1 oz., 2 oz.
Detailed description of the board can be found in the JESD 51-7 standard.
Package Thermal Resistance⁽¹⁾⁽²⁾
Package
144-Lead,
LQFP
θ_JA
43.6°C / W
θ_JC
12.5°C / W
psi_JB
39.0°C / W
(1) Soldering process must comply with National Semiconductor’s Reflow Temperature Profile specifications. Refer to
www.national.com/packaging.
(2) Reflow temperature profiles are different for lead-free and non-lead-free packages.
10
Submit Documentation Feedback
Product Folder Links: ADC08DL500
Copyright © 2011, Texas Instruments Incorporated